Thermal Degradation Mechanism of Electric Joint Compound Used in Terminal Connectors

Electric joint compound is a type of organic composites which has been widely used between terminal connectors. The main function of electric joint compound is reducing the contact resistance of the terminal connectors and slowing down the corrosion of metal. Recently, we found that the aging of electric joint compound has a great influence on the contact resistance of terminal connectors. With the process of aging, contact resistance of the connectors became higher and higher, which lead to abnormal fever problems. In order to prevent abnormal fever problems, it is necessary to analyze the aging process. However, the aging mechanism of electric joint compound is unclear. In this paper, artificial accelerated aging tests were put on the electric joint compound to simulating its aging mode. Thermal Oxidative aging experiments are used to simulate the degradation process of the electric joint compound in nature. We also compared the difference between natural and accelerating aging samples. Macro analysis tests including cone penetration, dropping point and storage stability were measured. Micro structural analysis tests including FTIR, XPS, SEM were used to proclaim the changes of the electric joint compounds.