Mechanical Properties of Epoxy-POSS Composites at Low Temperature Based on Molecular Dynamics Simulation

Epoxy resin is an important part for superconducting devices, adding nanoparticles into epoxy is an effective way to improve the electrical properties. However, mechanical properties of the epoxy resin at low temperature is not clear. In this paper, pure epoxy and epoxy-polyhedral oligomeric silsesquioxanes (POSS) models are proposed. Then molecular dynamics simulation was used to analyze the mechanical properties. Our results show that POSS nanoparticles can improve mechanical properties of the epoxy at low temperature. The bulk modulus decreases with increasing temperature, and the effect of POSS particles varies when the temperature changes.