Decapsulation Method for 3D Stacked-die Packaged Devices

3-dimensional (3D) stacked-die package is one of the important package styles for MEMS inertial devices. Its unique packaging brings new challenges for its decapsulation method. In this paper, a new decapsulation method for 3D stacked-die packaged MEMS inertial devices is introduced with method's steps, technical flow and application. This decapsulation method is the combination of laser-decap and multi-steps chemical etching. It reveals the stacked-dies layer by layer and makes the possibility to analyze the structures in the MEMS inertial devices, such as accelerometer, gyroscope, ASIC, etc. It provides good technical support for inner-inspection of 3D stacked-die packaged MEMS inertial devices.