Experimental Study of Panel Level Packaging Warpage

This paper presents an analysis on panel warpage as the growth of the panel exceeds beyond current wafer sizes. This work is a part of iNemi working group "Wafer/Panel Level Package Flowability and Warpage Project". The aim of the project is to understand material, process and design factors that impact on flowability and warpage. This paper focuses on warpage measurement aspect: method and results.