Assessment of 2x Thru De-embedding Accuracy for Package Transmission Line DUTs

This paper examines 2x Thru de-embedding accuracy for uniform package transmission line devices under test (DUTs). Accuracy is first assessed using 3D modeled data, with and without 2x Thru impedance mismatch. The learnings from this analysis are then applied to improve the match between de-embedded measurement data and modeled data.