Detecting Resistive-Open Defects of TSVs in Power Distribution Network of 3D-IC

A method is proposed which detects resistive-open defects of power TSVs in power distribution networks by measuring resistance between power micro-bumps. Utilizing the monotonically increasing property of the measured resistance when the resistance of TSV under test increases, the method defines the minimum defective resistance R
_min
of TSVs and uses it as the resistance of defective TSV in statistical fault simulations. Simulation results of a 3D-IC example with two dies show that the proposed method can detect resistive-open defects although defect coverage is decreased when R
_min
is decreased.