Reliability of Solder Joints on CBGA Packaging under Temperature Cycling Condition

In this paper, a three-dimensional calculation model of CBGA144 packaging device was established by finite element simulation software. The stress and strain distributions of 90Pb10Sn solder joints under -55°C~125°C temperature cycling condition were analyzed. Simulation results indicate that the key solder joint of CBGA144 packaging device is in the corner of the solder joints array. The largest stress and strain areas occur on the top-surface of the key solder joint near the ceramic substrate, and there is a tendency of stress and strain accumulation after five temperature cycles, the largest stress and strain of the key solder joint occur in the fifth cycle. The fatigue life of the key solder joint is 1179 cycles calculated by Coffin-Manson equation.