Study on Influencing Factors of Gold Wire Bonding Performance of Nickel-free Soft Gold Microwave PCB

With the increasing application of nickel-free electroplated thick soft gold high frequency microwave PCB products, the reliability of the gold wire bonding process has received widespread attention. The article studies the influence of bonding parameters and gold surface quality on the bonding performance of gold wires. The results show that the combined power and tension of the gold wire bond will increase first and then stabilize with the increase of USG and Time, and increase and then decrease with the increase of Force. The thickness of Au-free soft gold Au is thick. When it reaches 0.3 μm, it can meet the bonding needs, but for products with a rough surface Rq greater than 1.0 μm, when selecting the bonding parameters, the bonding time Time can be appropriately extended, and USG and Force can be adjusted to increase the split Output power to improve bonding effect and improve bonding performance.