A reliability evaluation software for Flip Chip based on failure physics

This paper introduces the flip chip reliability evaluation software developed based on failure physics. Firstly, the system framework of the software is introduced, and then the core algorithm of the software is described. Key parameters such as stress, strain, plastic strain energy density, displacement, acceleration can be extracted, and the service life of the selected structure is obtained through relevant failure physical models. The lifetime of each key structure is used to obtain the lifetime of the whole flip chip device through the competition algorithm of short board effect. An example of Flip chip device reliability evaluation under condition of standard GJB548B-2005 method 1010.1 C temperature cycling was given, it shows that the predicted device life is 207 cycles.