Hybrid integrated packaging of a typical microwave-to-optical converter

RF over fiber system is an important application of microwave photonics. Microwave-to-optical converter is the key part of RF over fiber system. Thus, the high integration and high reliability package of microwave-to-optical converter becomes an emphasis of current research. To meet this need, the package design mentality, packaging process flow, specific procedure and key points of a typical microwave-to-optical converter were introduced, including optical train design consideration, housing design consideration, optical train assembly, microwave train assembly, etc. This converter used hybrid integrated packaging technology and realized the array assembly of microwave dies and photonic dies in one hermetic package. This packaging method can be applied to other microwave photonics products for the increment of integration and reliability of RF over fiber system.