Black equation of the electromigration lifetime for ceramic package with lead bumps and plastic package with lead-free bump

In this study, electromigration accelerated life tests of lead-containing copper pillar bumps in ceramic packages and lead-free copper pillar bumps in plastic packages were carried out at different current densities and ambient temperatures. The electromigration life prediction model based on Black equation was established for the two. The influence index n and activation energy Q of current density of interconnection bumps with two structures were determined through MTTF analysis of samples. Based on the life prediction model, the effects of substrate material, temperature and current density parameters on electromigration life were compared. Finally, considering the influence of Joule heating effect and current crowding effect, the electromigration life prediction models of the two bumps are modified.