Study on the Effect of Sintering Process on Copper Nanoparticles

Copper nanoparticles(Cu NPs) can form bulk copper with high melting point and resistance to electromigration. They can be used in low temperature interconnection for high temperature, high frequency service. In this article, commercial Cu NPs with size of 60-100nm were mixed with terpineol uniformly to prepare copper nanoparticle paste(Cu NP Paste). The effects of different heat preservation time, heating rate, sintering pressure and other process parameters on the sintering of Cu NP paste were explored. Under the 0.1°C/s heating rate and the pressureless sintering process of holding for 30 minutes, the shear performance of the Cu-Cu joint is improved. At the same time, the Cu-Cu joint with a maximum shear strength of 28.6MPa was also obtained under a sintering pressure of 2MPa. A large number of dimple-like structures appeared at the joint fracture. A metallurgical bond was formed at the joint, which basically satisfied the packaging strength of semiconductor power devices Claim.