Reliability evaluation of typical gold-containing solder joints for products

The high reliability of solder joints is the eternal pursuit of aerospace product engineering and technical personnel. The problem of solder joint failure caused by golden brittleness has troubled scientific and technical personnel for a long time. The golden brittle failure behavior of SnPb solder joints has become an issue that must be considered in the manufacture of aerospace products. However, the evaluation for the gold content of solder joints is a difficult research point. With the development of electronic assembly technology towards high density and miniaturization, the solder joints have become more and more fine, and the standards that have caused gold brittleness have caused widespread controversy. This article adopts the process of SnPb solder widely used in the current electrical interconnection of aerospace products to form solder joints on gold-plated surfaces, selects representative CLCC, LGA and crystal oscillator devices, uses slice detection methods, and uses scanning electron microscopes and energy spectrometers. The gold-containing solder joints were analyzed from the aspects of the gold content of the solder joints, the morphology of the solder joints, the morphology of the intermetallic compounds, and the quality of the solder joints after the temperature cycle aging test. The reliability of the gold solder joints was studied, and the solder joints were further predicted. It has very important reference significance for determining the acceptable standards for gold-containing solder joints and determining the service life of products.