Research on the Mechanism and Influencing Factors of Gold Ribbon Interconnection of Microwave Circuit Based on Parallel Gap Welding Technology

Adopt the tip ohmic contact type parallel gap welding technology to conduct the gold ribbon pressure welding test on the surface of the microwave integrated circuit substrate. Using the advanced ohmic contact parallel gap welding technology, a gold ribbon pressure welding test was carried out on the surface of the microwave integrated circuit substrate. The welding heat source and interface organization were studied by establishing an equivalent resistance model of the welding circuit and a function model. At the same time, the influence of pressure, voltage, time and the frequency of electrode usage on the tensile force and fracture mode of the pressure welding point were also studied. The test results show that the main heat source during the pressure welding of the gold tape is the Joule heat generated by the ohmic contact resistance at the electrode tip. The microstructure observation reveals that there is no common grain at the interface of the pressure welding point. The influence of voltage, pressure, time and the frequency of electrode usage on the tensile force of the pressure welding point decreases in sequence. As the voltage increases, the tensile force of the pressure welding point decreases first and then increases slightly. With the increase of pressure, the tensile force of the pressure welding point increases. As the frequency of electrode usage and time increases, the tension of the pressure welding point decreases slowly. The theoretical optimal parameters are 24Oz-5ms-0.5V and 0 times electrode frequency.