Simulation study f the selective soldering process of the electrical connector to Printed circle board

With the density of the components in a PCB greatly increased, traditional manual soldering process are not suitable to soldering complex device like electrical connector to high capacity PCB, therefore auto selective soldering system are selected. In this article, FEM method is applied to simulate the temperature field and get the temperature filed. Heating process of the spray tin is simulated by the moving heat source. Relationship between the preheating temperature, temperature and moving rate of the sprayed tin is studied through the orthogonal matrix method. After research, The moving rate of the tin spray 3.5 m/s, preheating temperature 100 and the temperature of the spray tin 250 °C is considered to be best to form a good solder joint.