A Novel Optimization Algorithm for Thermal Design of MCMs

The layout optimization of components becomes a key role on thermal analysis and design of the multi-chip module (MCM). In this paper a novel modified thermal force-directed placement algorithm (MTFPA) is proposed, with the consideration of the components' size effect and improved the efficiency of TFPA. The simulation results show that, while maintaining optimal components placement, the modified algorithm can effectively overcome the components' overlapping and out-of-boundary problems occurred in the original TFPA, and reduce computation time significantly.