"Molded-package-last" Process for Fan-out System in Package (FO-SiP)

"Molded-package-last" process has been newly developed for fan-out system in package fabrication. In this process, the RDL and the molded-package including IC and passive component were separately fabricated, and then assembled by second molding and reflow process for main and collective bonding. Molded-package-last process doesn't need long serial fabrication process, therefore it is highly productive compared with conventional chip last or chip first method. The obtained package showed good alignment accuracy between the RDL and the molded-package, and moreover, good solder connection.