3D Composite Glass-silicon Interposer Integrated With Polymer Arrayed Waveguide Grating

Integrating optical interconnects onto TSV/TGV based interposer to meet the ever-increasing chip-to-chip bandwidth demand has received continuously growing interest. Besides optical interconnections, passive optical device with relatively large footprints and low fabrication cost also holds the potential to be directly integrated onto current interposer technology. In this study, a polymer-based low-index-contrast arrayed waveguide grating(AWG) is integrated onto the 3D composite glass-silicon interposer to realize wavelength division (de)multiplexing (WDM) applications. The 3D composite interposer is fabricated by glass reflow process, polymer arrayed waveguide grating which has single mode waveguide platform is then directly fabricated onto the interposer. The feasibility of using borosilicate glass as bottom cladding of on-interposer optical waveguide and passive optical device has been verified through both simulation and experimental results. Transferring area-cost optical devices from photonics chip to composite interposer provides a promising solution to enhance the integration density.