Direct Micro-Pin Jet Impingement Cooling for High Heat Flux Applications

This study explores the heat transfer from directly manufactured micro-pins undergoing in jet impingement. Micro-pins that are directly attached to the chip eliminate the need for thermal interfaces, and the lids that exist in conventional electronic packages, while also occupying a smaller areal footprint. In this study, the effects of different outlet port positions and pin cross-sections and profiles are examined through simulations. Results from the study show that the outlet port position has a significant effect on hydraulic and thermal resistances. Also, by modifying the height and profile of the pins, a 47% reduction in pressure drop was achieved without sacrificing the thermal performance.