Wetting Balance Measurement of Solders and Evaluation of Strong Influences on the Shape of the Wetting Curves

The aim of this article is comparing three types of solders} (one lead. Sn63Pb 37 and two leadfree: Sn95,5Ag3,8Cu0,7 and Sn 97Cu3), four types of fluxes and two types of samples (copper and aluminium wire) with different thermal capacity (diameter 1 mm and 2.2 mm). The wetting curve was evaluated from the point of zero-cross time and maximal wetting force. The results show that the best results from the overall point of view were achieved for Sn63Pb 37 and the worst for Sn 97 Cu
3
solder alloy. The most substantial influence on the wettingforce has the material of substrate and type offlux.