Adhesion Study on Different Surface Treatment by Button Shear Test

Buffer material has been widely used in semiconductor industry owing to its unique properties which can be tailored to fulfil the needs of the wafer manufacturing. Adhesion between buffer material and mold compound is important to ensure there is no reliability risk such as delamination or popcorn effects after reliability stress. Due to the stringent requirements in automotive industry, adhesion between mold compound and buffer material become extremely crucial. This paper illustrates the comparison between different surface treatment and the interaction to adhesion strength between mold compound and buffer material. The effect of surface morphology on adhesion between buffer material and mold compound were characterized by using a number of analytical tools including scanning electron microscope (SEM), atomic force microscope (AFM) and button shear test.