Process, Design and Simulation for Millimeter Wave Chip Packaging Using Embedded Glass Fan-Out Technology

Millimeter wave (mm-Wave) wireless communication is widely applied in automotive radar and 5G communication applications. High performance, low manufacturing cost and high integration density packaging for mm-Wave chip is critical and challenging. Over the past years, many advanced packaging technologies emerged and fan-out wafer level packaging (FOWLP) has drawn more and more attention due to its advantages such as high I/O density and integration flexibility. In this paper, a fan-out package named embedded glass fan-out (eGFO) for mm-Wave chip is demonstrated. Compared with standard FOWLP, eGFO technology uses glass as substrate and it is a simple technology without temporary bonding and de-bonding processes in package flow. In this work, a 28 GHz mm-Wave chip with size of 1.65mm×1.75mm is integrated by eGFO technology. The scheme of eGFO package with size of 4mm×4mm and one RDL is designed. The package uses coplanar waveguide structure to control impedance matching at 50 Ohm. The electrical performance is studied through the finite element analysis. The results show that the eGFO packaging is promising for mmWave which requires excellent electrical performance, low cost and high density integration.