Vibration and Thermal Fatigue Reliability of CCGA Components

With the development of technology, the requirements for high density and high reliability of electronic components are constantly increasing, and more challenges are placed on packaging technology. CCGA (ceramic column grid array) is developed on the basis of CBGA. It replaces the solder ball with a slender solder column. With the good creep resistance of the solder column, it adapts to thermal stress mismatch for the difference in thermal expansion coefficient between the PCB and the ceramic substrate. Compared with CBGA, CCGA is more suitable for more I/O and large package and assembly, but compared to other package types, CCGA package faces many challenges such as cost and mechanical reliability. In this paper, the finite element simulation technology is used to simulate the vibration and thermal reliability of CCGA solder column with different column types and different materials. The finite element model established by simulation includes key structures such as heat sink, chip, ceramic substrate, solder column, PCB, etc.