CU Core Column Enables Fine Pitch & High-Density 3D Packaging

As the next-generation interconnection materials, Cu core column is a kind of cylindrical-shaped copper core with Ni and solder plating. It could replace ordinary solder balls, Cu core balls and even Cu plated posts and has become the focus of attention. Cu core columns have innately ability to control and maintain a consistent standoff height, and can achieve excellent electrical and thermal conductivity due to the excellent physical properties of copper. It is known that the Cu core column can exhibit sufficient performance compare with solder balls and Cu core balls. In this study, after experiment we know Cu core columns with lower aspect ratio and small core diameter is better for drop test. Cu core columns with higher aspect ratio and less solder amount is better for Thermal Cycle Test.