Monothic Integration of Pressure Plus Z-Axis Acceleration Composite TPMs Sensors with $1.0\mathrm{mm}\times 1.0\mathrm{mm}$ Chip-Size and 0.09$/Die Fabrication-Cost

This paper presents a low-cost and high-yield batch fabrication technique for monolithic integration of pressure plus acceleration composite TPMS-sensor for the ever-growing demand of the automotive electronics market. Herein, a subtle backside-etching self-stop technique in non-SOI wafer, which is further development on the basic of the MIS process [1], is developed and used to flexibly fabricate z-axis accelerometer. Testing results show that besides the highperformance, the fabricated TPMS sensor has the advantages of small chip-size of 1.0mm×1.0mm, high yield of more than 90% and low fabrication-cost of 0.09$/die.