Improve Solder Extrusion for Large Size Stand Alone Module

SiP (System in Package) module products are always a focus of USI's R&D efforts. USI's efforts in module development have been focused on wireless modules since 2000, including WiFi, Bluetooth, GPS and WWAN (GSM/WCDMA/LTE). Products have been pouring out of production line every stage with outstanding performance. Handheld products, such as cell phones and PDAs are becoming smaller and so do the parts and components. The miniaturization of module products is, therefore, inevitably a challenge for USI and, of course, SiP products that are increasingly difficult to manufacture and more complicated are in demand. On the other hand, USI never backs down from challenging manufacturing processes and has a good number of patents. In this era where the diversity of consumer products keeps growing, the production cycle of samples has to be shorter to encourage greater competitiveness. As a result, SOM (System on Module) module products were born. SOM products feature more complicated functions, including CPU + DDR/eMMC + Power IC + Audio + Require Components, and that call for more complicated manufacturing processes, which in turn takes USI's process capability to the next level.