Evaluation of Crack Propagation at the Interconnection Interface Induced by Warpage of Fan-Out Wafer-Level-Package

This study is to evaluate crack propagation possibility at the interconnection interface of FOWLP induced by warpage. The strain energy release rate (SERR) around the region of interests was calculated using Finite element (FE) analysis. The estimated SERR was compared with the measured critical SERR to predict the risk of the crack propagation at the interface. Moreover, a parametric study was performed to analyze the sensitivity of design parameters to define the most critical one affects crack propagation. This study may give ideas of delamination at the interconnection interface and the main parameter results in the failure induced by warpage of FOWLP.