Three-dimensional stacking miniaturization and high frequency of resonant ring

When the electronic products are going to high-frequency and high-speed, electromagnetic interference is caused by the coupling between the lines. Controlled electromagnetic coupling is becoming an important basis for designing lines; in addition to the coupling mechanism, the development of miniaturization of electronic products, using Z-axis superposition to couple to reduce the circuit area, is also an important design basis on the system circuit. This paper is to analyze the coupling feeding mechanism of the resonant ring and the coupling mechanism between the resonant rings, and introduce the near-field radiation field type verification technology. The three-dimensional stacking of the circuit is achieved by redesigning the coupling mechanism. Miniaturization and high frequency are the main purposes of this study.