Signal Integrity Analysis for Dual-Stripline Design

In today's PCB design, dual-stripline is gaining more popular as it provides more density for signal routing of little PCB thickness therefore thinner products. However, it is becoming more important to keep track of signal and power integrity issues brought by the convenience of dual-stripline structure. It is well known dual-stripline crosstalk would cause severe problems for signals, in addition, for power rails as well. It is important to predict the problem beforehands with simulation and avoid the troubleshooting and debugging. In this work, the investigation of dual-stripline design is studied to figure out signal-to-signal coupling. A comprehensive solution is provided for this convenient structure in both simulation and measurement manners.