Electrically Conductive Paste Printed Volume Influence on Bonds Properties

The paper presents the investigations of bonds mechanical and electrical properties function of electrically conductive paste printed volumes. For the experiments, it was taken into consideration the SW180 electrically conductive paste type which was used only for bonding chip resistors on the pads of interconnection structure having electroless Nickel immersion Gold (ENIG) finishing. The test vehicles contain a daisy-chain structure with ten 0 Ω resistors, 2512 case. The printed volume was controlled by the stencil thickness (100/150 μm). The mechanical tests (shear test) had been performed at five different temperatures (298/323/348/373/398 K) and they had been completed with electrical measurements and microstructural analysis.