A Novel MIM sandwich structure of the SCM probe for tool inspection

In this article we combine FIB-CVD technology on the probe and create a novel MIM structure for tool inspection, it does not require surface preparation process and easy to measure the p-n junction effectively in order to observe the electronic hole impurity distribution. We've replaced traditional SCM probe tip by new probe which are consisted of the tungsten layer and oxide layer as the capacitive dielectric. We solved the problem of the sample preparation process bring about SCM image quality instability problem. In addition, the most advantage is the new MIM probe can achieve the goal of direct measurement on sample without any sample pretreatment procedure.