High throughput two-stage bonding technique for advanced wafer level packaging

Thermo-Sonic Flip Chip Bonding (TS-FCB) is an already established technology for chip on wafer (CoW) applications in the industry. As a very fast and reliable interconnection process [1] it has been chosen for this project to temporarily tack small and medium sized ICs on the substrate. Its individual chip placement allows high yields per substrate. Metallic interconnections with high reliability were formed and characterized using a thermo-compression gang bonding oven with a capability to process substrates with topography [2]. Both techniques together combine high productivity with flexible, reliable, and well known fluxless process providing a new solution to drive the integration towards future needs.