Study on Temperature Impact of the Dielectric Material Loss for AiP Application

To ensure the performance of antenna-in-package (AiP) design, the temperature impact of substrate should be considered because the gain is strongly influenced by the material loss. This paper presents the study results of the dielectric loss at room temperature (25 degrees Celsius) and high temperature (85 degrees Celsius) up to 50 GHz by transmission line method. The transmission loss is firstly de-embedded from two different length lines, and the dielectric loss is then extracted from the measured transmission loss by separating conductor loss according to different temperatures. The conductor loss is modeled with thermal dependent performance, surface roughness and nickel plating effect on the microstrip line. An ultra-low loss substrate material is utilized and demonstrated in this work.