A More Than Moore Enabling Wafer Dicing Technology

As the materials that the wafer dicing process need to singulate become more complex a diverging current Process of Record (PoR) dicing technologies are not able to meet the quality and or cost requirements. Laser provides the solution to dice all these different materials but has the challenge to achieve the die strength level specified. In this paper we will elaborate on the advances made to apply a laser full cut process while achieving the required die strength.