Epoxy Composites with Surface Modified Silicon Carbide Filler for High Temperature Molding Compounds

With the rapid development of high power, high frequency and high-density electronics, heat management of the package has attracted intensive attention. Thermal conductivity is becoming an increasingly important parameter in the evaluation of packaging materials like EMCs. However, for polymer in encapsulation materials such as epoxy, their low thermal conductivity due to the phonon scattering issue greatly limits their ability in heat dissipation. Therefore, it is worthwhile to study the modification of filler system for the improvement of thermal conductivity of EMCs, since filler occupies 70-90 % of the weight in EMCs. In this work, SiC particles are coated with silane and rubberized layers for molding compounds as a modified filler. The effects of treated SiC filler on thermal conductivity and toughness in epoxy composite are studied at low filler loading.