A Novel Panel Level Double Side Embedded Package for Small Size Power Devices

For small size devices, fan-out chip-embedded technology has become an attractive and holistic packaging solutions with various advantages in comparison to conventional and mature technology. And high efficient and high reliability of the embedded package for small-size power devices has become a hot topic in industry. In this paper, a novel panel level double side-embedded packaged process (DS-Embedded) for small size power devices has been presented. The entire process can be performed on both sides of the carrier. In order to reduce cost and time-to-market, 2D and 3D finite element model were used to get a reliable package structure. The result shows that the thermomechanical fatigue life of the model after parameter optimization is much larger than the actual use requirements which was in good agreement with the experimental result. The actual reliability tests such as vibration, mechanical shock, shear test also prove the feasibility of the product. However, the failure problem caused by Ag corrosion and migration in the H3TRB experiment still needs further improvement.