A Novel All-in-One Digital-Analog Heterogeneous Integrated Intelligent Power Module

This paper introduces a novel all-in-one digital-analog heterogeneous integrated intelligent power module (IPM) which is composed of Si MOSFETs, Gate Driver and Micro Controller Unit (MCU). This novel all-in-one module realized by heterogeneous integration offers a System in Package (SiP) solution without causing serious Electromagnetic Compatibility (EMC), signal integrity and thermal issues. In addition, we designed the three-phase half-bridge inverter system formed by this IPM to compare with the system consisting of the same circuit and same bare dies of MOSFETs (TO-package), Gate Driver and MCU (SO-package). The performance shows that the inverter system which adopted this intelligent power module is capable of reducing system energy consumption, enhancing system efficiency (2-4%), and successfully shrinking system volume(>33%) at the same time. Besides, this SiP IPM can improve system reliability, electromagnetic compatibility (EMC) performance and pass the international standard of CISPR 11. Keywords-SiP, heterogeneous integration, IPM, EMC, power density.