Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors

We propose a triple-stacked wafer-to-wafer hybrid bonding technique for image sensor 3D integration by repeating (1) embedment of gold electrode sites, (2) Au/SiO
₂
bonding with a thin Si layer in between, and (3) subsequent lost-wafer processes.