Photonics Chip-to-Chip Communication for Emerging Technologies: Requirements for Unified RF, Millimeter-Waves and Optical Sensing

This paper shows an application of hybrid combination of agile Millimeter-wave and Optical waveguiding solutions with advanced CMOS, BiCMOS, SOI technologies will enable new possibilities for Chip-to-Chip communications with high data-rate and improved broadband RF performances. Such hybridization will benefit to wide range of applications relative to mobile communications with smart devices and systems: e.g., practical applications relative to autonomous vehicles including machine learning and cognitive signal processing. Requirements for unified RF, mm-Waves and Optical sensing are drawn toward optical MIMO and Phased-Array systems implementing 3D Chip-Package-PCB-Antenna Co-Integration technologies combined with smart data fusion with environmental awareness.