HFSS simulation of wireless inter-chip communication for 5G applications

The signal transmission effect of the three-dimensional stacked die with capacitive coupling interconnection is analyzed in this paper. The results of the HFSS simulation show that the differential signaling quality depends on the size of the signal pad and the pad pitch. The 3D pad placement design methodology can be applied to expedite the optimized implementation of a stacked die structure. This is very important for the Fifth Generation (5G) of mobile network communication technology applications.