Si-Based Hybrid Microfluidic Cooling for Server Processor of Data Centre

Si micro-fluid heat sink, which has attracted extensive attentions, can achieve high heat dissipation capability, while requiring very low pumping power and small coolant volume. Based on simulation investigation, a Si-based micro-fluidic solution has been developed for high performance processor cooling. A stacked micro-fluid heat sink with micro-jet slot array, micro-scale draining trenches and micro-pin fins, is designed and fabricated. With volume flow rate 1L/min and pressure drop smaller than 3kPa, spatially averaged heat transfer coefficient of $\sim9.6\times10^{4}\mathrm{W}/\mathrm{m}^{2}\mathrm{K}$ can be achieved using the designed micro-fluid structure. Experimental tests have been performed, and the results agreed quite well with the simulation data. To dissipate 150W heating power of thermal test chip, the maximum chip temperature rise can be maintained less than $25^{\circ}\mathrm{C}$. The developed hybrid microfluidic solution will be a good candidate for thermal management of server processor in future advanced data center.