Electronic Packaging Solutions for Artificial Intelligence Applications (Invited talk)

Artificial intelligence is the most talked about technology. Because of its widespread influence on all aspect of human life in the next decade and beyond. Name a few, Self-driving cars, bio-tech, health, medicine, robotics, smart cities, AIoT, Energy and FinTech, the list goes on and on. To electronic packaging the hardware of AI, there are many types of packaging forms depends on the system architecture of the AI. Basically, it follows Von Neumann computer architecture for high performance computing (HPC). Processors are closely communicated with the nearby memory units for data exchange. There are other emerging technologies for AI, like quantum computing and Neuron inspired processor. This paper is focused in the packaging of high end Von Neumann type of computer system.