High Volume Silicon Based Technologies for Heterogeneous THz Platforms: From the Silicon to the Board

When 5G is about to be real for the below 30 GHz, industries are looking already for what will come after that. It is clear to the community that the trend is to move up in frequency to increase the network capabilities in terms of bandwidth. Within the M3TERA project Infineon and its partners are investigating the technologies of the future THz wireless communications. The talk will give a high level spot to these promising technologies from the silicon to the board and the challenges that must be solved to enable new products in the market (process issues and limitations, THz interfaces, mechanical problems, etc.).