LCP Ultra-Wideband Self-Packaged Microstrip to Stripline Transition with Multilayer Balun Demonstration

An Ultra-wideband (UWB) microstrip to stripline transition using liquid crystal polymer (LCP) technology for multilayer circuits with self-packaging feature is presented in this paper. The proposed design is light in weight, cost effective and remarkably miniaturized. In order to validate this approach, a prototype is designed, simulated and fabricated. In addition, this packaged transition is tested on a new multilayer balun to account for any losses introduced to the hosted balun further ensuring the significance of this work.