Will 3D-semiadditive packaging with high conductive redistribution layer and process temperatures below 100°C enable new electronic applications?

The main challenge in 3D-additive packaging is the manufacturing of the conductive redistribution layer. In most state-of-the-art and recent research, conductive polymer and nanoparticle sinter inks are used to print the conductive layers. However, these inks show several disadvantages regarding the conductive properties, solderability and fabrication temperatures, which are above 100°C for sintering or curing the ink. Therefore, a novel customized 3D-semiadditive package has been developed with a high-conductive redistribution layer and the fabrication temperatures are kept below 100°C. This new approach allows the deposition on the surface of the 3D-semiadditive package. The combination of additive and semiadditive technologies reveals many applications in the fields of electrical engineering especially in biomedicine (e.g. life sciences), mechatronic (sensors and actuators), and opto-electronics. This paper will show a new approach and focus on different 3D package applications. First demonstrators of 3D-semiadditive packages are presented, which illustrate the high-conductive redistribution wiring on the top of additive embedded IC-components, as well as the microstructure between the pads of a component and the redistribution layer. Furthermore, first reliability results show no significant changes of the interconnection after thermal shock aging of 2000 cycles (-20°C; + 85°C, dwell time: 30 minutes).