Extremely Fast Thickness Measurements with an ECOPS-Based TD-THz System

We employed a time-domain terahertz system based on electronically controlled optical sampling to measure the thickness of a piece of a silicon wafer. The system acquired 1600 terahertz pulse traces per second, which - to the best of our knowledge - represents the fastest thickness measurement achieved with any terahertz system to-date. We compare the results to values measured with a conventional terahertz system and a micrometer gauge.