I. Introduction
In recent years, driven by the trend to lighter, thinner and smaller competitive products, smaller package types particularly flip chip packages have been consolidated with solder bump interconnections is applied extensively in electronic device manufacturing especially in industrial backend assembly house [1]. Flip chip technology is firmly progressing toward smaller packages which leads to smaller bonds and bumps. A flip chip is a chip that mounted on the substrate with the flip chip active site area facing towards the substrate and the bonding feature is a combination of metal, solder bump and metal pads.