Cantilever Gold Ribbon Bonding used in MMCM

Cantilever gold ribbon bonding technology plays more and more important role in making high current electrical connections in microwave multi-chip modules (MMCM). Cantilever gold ribbon bonding was studied in the paper, the optimal process parameters of cantilever gold ribbon bonding technology were gained using Taguchi method to improve the ribbon bonding reliability. Cantilever gold ribbons with high reliability are obtained by using optimal bonding process parameters.