An Exhaustive Search of the Optimal 6C Level Static Shielding Scheme for Rectangle TSV Arrays

Through-silicon via (TSV) is one of the key enabling technologies of stacked 3D ICs. However, the crosstalk among the adjacent TSVs decreases the performance of TSV bus and deteriorates the signal integrity. The static shielding wire is an effective crosstalk suppression method. Till now, the systematic design method of the shielding scheme under the constraints of crosstalk severity level and size of TSV array has not been studied. This paper proposes an exhaustive search technique of static shielding scheme for the lowest system overhead. Experimental results on 6C crosstalk severity level case for the rectangle TSV arrays validate the effectiveness of the proposed technique. And the comparison results between the optimal crosstalk avoidance code (CAC) and the optimal static shielding scheme show that the system overhead of the static shielding scheme is usually higher than that of the CAC counterpart for different TSV array sizes.