Research on heat dissipation of a new rectangular microchannel structure based on thermal bimetal

With the shrinkage of package size and the increasement of the integration, the heat dissipation in the electronics package deteriorates. Microchannel technology therefore becomes one of the most active areas of research in thermal management. This paper investigated the impact of local deformation structure in a rectangular microchannel on heat dissipation performance, and a solution was proposed by introducing thermal bimetal to the rectangular microchannel. The thermal bimetal was designed to contact with the heat source through thermal columns, and the deformation of thermal bimetal regulates the flow velocity of local cooling fluid in microchannel to achieve self-adapted heat dissipation management. The results indicated that the concave thermal bimetal rectangular microchannel outperformed than the ordinary microchannel due to its lower average temperature and lower temperature difference, therefore kept the heat source chip (e.g. PA) at a lower temperature. These efforts could be helpful for the design and optimization in microchannel cooling system for high power chip packaging.